Samsung Galaxy S5 Teardown.
I really like the teardown of Samsung Galaxy S5 posted on teardown.com. The comparison table of S4 vs S5 shows the improvements made to the flagship Galaxy phone. A slightly bigger screen 5.1″, better battery 2800 mAh, higher resolution camera 16 MP and most importantly, upgraded mobile processor. The BOM cost edged up from $192.61 to $206.44. Also new is a fingerprint scanner which uses Synaptics VAL0048A8-T chip.
There is also a picture showing the S5 partially submerged in water. So, there is a certain level of waterproof protection added to the S5. Another interesting thing mentioned by one of the teardown reports is that Samsung has completely reconfigured the inside of the phone making it difficult to open but easier to repair.
Here are more details on the new Amazon Fire TV, credit goes to JJWu
According to Microchip’s CEO, Steve Sanghi, the semiconductor industry business model is really broken and he felt that there would be more belt tightening and consolidation ahead. He was quoted in EE times:
“Three years ago you wouldn’t have forecasted Texas Instruments would buy National, and Avago and LSI would merge. Who would have thought Fujitsu’s semiconductor group would be no more — now part of Spansion — or that Sanyo would not be making chips? It’s all a sign there’s not enough growth.”
He didn’t include the pending merger of RFMD and Triqiunt, acquisition of Mindspeed by MA/COM and the possible acquisition of Renasas by Apple. So, it seems like the chip industry will continue to face tough times ahead.
I can see his point of view but I am not as pessimistic and I feel that innovation and responding to market demands and solving real world problems are key to winning in the semiconductor industry. I feel that despite the tough environment, the future is still bright. Companies will find ways to innovate and to grow.